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TSMC will start producing fingerprint sensors for the next-generation iPhone in the second quarter, industry sources claim. The supplier will reportedly use a 65nm process at its 12-inch fab, and also bring backend wafer-level chip scale packaging in-house, instead of subcontracting it. In-house packaging is expected to improve production yields; trouble with manufacturing fingerprint sensors is often believed to be the reason the iPhone 5s shipped in such low numbers last September….
